Isotech offers a full range of Fiber, C02, UV, Green, MOPA, Nanosecond, Picosecond and Femtosecond laser systems for marking, cutting and welding of many substrates. Isotech offers both standard systems as well as fully automated or custom systems depending on your specific requirements. Integrated, automated solutions with conveyors, palletized pick and place, rotary dial tables, hoppers, and robots are all part of the engineering we offer.
Lasers Power Pages
CO2 Lasers
A carbon dioxide laser is a device that utilizes carbon dioxide as the gain medium and Nitrogen (N2), Helium (He). To some extent, it also uses hydrogen (H2), water vapor, Oxygen and/or Xenon (Xe) to improve the...
Labeling Machinery
Labels are an important aspect of product packaging, identification, presentation, and traceability. They are a way of communicating the manufacturer to the customers and the rest of the world. Labels promote the brand of the product and...
Marking Machinery
Marking machinery is industrial equipment that specializes in creating texts, graphics, labels, and codes on parts and products. Each type of marking machine has different mechanisms in modifying the properties of a material to create the desired mark...
Metal Etching
Metal etching is a metal removal process that uses various methods to configure complex, intricate, and highly accurate components and shapes. Its flexibility allows for instantaneous changes during processing...
Laser Marking and Engraving Machinery
Laser marking applies readable text on a component's surface with little or no penetration. However, laser engraving is when information is applied to a part using a laser, and there is clear penetration behind the material's surface...
Laser Cutting
Laser cutting is a non-traditional machining method that uses an intensely focused, coherent stream of light called lasers to cut through the material. This is a type of subtractive machining process where the material is continuously removed during the cutting process...
